But seriously, it is an incredible process to make these things. The easiest bit is to look at the metal interconnections.
Put down a thin insulating layer over the whole chip surface.
Put a thin layer of photographic emulsion (photoresist) over the whole chip.
Print a pattern of holes onto the photoresist.
Develop the pattern, so the exposed photoresist dissolves away, leaving the unexposed photoresist intact. So there are holes in the photoresist where you want them.
Put the whole thing into a plasma etching machine, which etches through the insulation where the holes are. The photoresist protects the rest of the insulating layer.
Wash off the photoresist.
Now you have an insulating layer with a pattern of holes through to the chip below.
Evaporate a layer of metal on top of the insulation. It connects to the chip through the holes in the insulation.
Now use the same photoresist process to print a pattern in the metal layer.
It's a complicated chip, so to get all the metal connections where you want them to go, it needs another layer of insulation, and another layer of metal patterns. And probably a third layer of insulation and metal too.
But once you've designed the chip, and the patterns for each layer, it's basically a printing process, and they can be churned out by the million.
Put down a thin insulating layer over the whole chip surface.
Put a thin layer of photographic emulsion (photoresist) over the whole chip.
Print a pattern of holes onto the photoresist.
Develop the pattern, so the exposed photoresist dissolves away, leaving the unexposed photoresist intact. So there are holes in the photoresist where you want them.
Put the whole thing into a plasma etching machine, which etches through the insulation where the holes are. The photoresist protects the rest of the insulating layer.
Wash off the photoresist.
Now you have an insulating layer with a pattern of holes through to the chip below.
Evaporate a layer of metal on top of the insulation. It connects to the chip through the holes in the insulation.
Now use the same photoresist process to print a pattern in the metal layer.
It's a complicated chip, so to get all the metal connections where you want them to go, it needs another layer of insulation, and another layer of metal patterns. And probably a third layer of insulation and metal too.
But once you've designed the chip, and the patterns for each layer, it's basically a printing process, and they can be churned out by the million.
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